Wylie
Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
€ 21,95
Niet op voorraad(Niet op voorraad)
1
- Besteld voor 19:30 (CET), dezelfde dag verzonden via PostNL, UPS of DHL.
- 30 dagen garantie - niet goed, geld terug
Beschrijving
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Specificaties
- Artikelnummer
- APP19785
