Wylie

Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max

€21.95

Out of stock(Niet op voorraad)

Order by 7:30 PM (CET), shipped the same day via PostNL, UPS or DHL.
30-day warranty - not satisfied, money back

Description

Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max