Apple
Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
€21.95
Out of stock(Niet op voorraad)
1
Description
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Specifications
- SKU
- APP19785
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